Close this search box.

Spectral characterization of PIC devices is key to test accuracy

August 22, 2022

The challenge of testing complex photonic integrated circuits (PICs) remains a key requirement to speed production while improving device reliability and the quality of finished products. EXFO describes key issues and solutions for improved testing of passive PIC components.


Bynet electronics logo testing monitoring communication

Enter your username and password to log into your account and Download premium content

*Don’t have a username and password for this site? no worries, click here and fill out the application form. Once approved we will send you your username and password.

Skip to content